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| MBRA340T3 Surface Mount Schottky Power Rectifier SMA Power Surface Mount Package Employing the Schottky Barrier principle in a large area metal-to-silicon power diode. State of the art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity diodes in surface mount applications where compact size and weight are critical to the system. Features http://onsemi.com * * * * * * Small Compact Surface Mountable Package with J-Bent Leads Rectangular Package for Automated Handling Highly Stable Oxide Passivated Junction Very Low Forward Voltage Drop Guardring for Stress Protection Pb-Free Package is Available SCHOTTKY BARRIER RECTIFIER 3.0 AMPERES 40 VOLTS 1 Cathode 2 Anode 1 Mechanical Characteristics: * Case: Epoxy, Molded * Weight: 70 mg (approximately) * Finish: All External Surfaces Corrosion Resistant and Terminal * * * * * Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds Shipped in 12 mm tape, 5000 units per 13 inch reel Polarity: Cathode Lead Indicated by Polarity Band ESD Ratings: Machine Model = C ESD Ratings: Human Body Model = 3B Device Meets MSL 1 Requirements 2 SMA CASE 403D PLASTIC MARKING DIAGRAM A34 AYWWG MAXIMUM RATINGS Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (At Rated VR, TL = 100C) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) Storage/Operating Case Temperature Operating Junction Temperature (Note 1) Voltage Rate of Change (Rated VR, TJ = 25C) Symbol VRRM VRWM VR IO IFSM Value 40 Unit V A34 A Y WW G = Device Code = Assembly Location = Year = Work Week = Pb-Free Package ORDERING INFORMATION 3.0 100 A A MBRA340T3G C C V/ms Device MBRA340T3 Package SMA SMA (Pb-Free) Shipping 5000/Tape & Reel 5000/Tape & Reel Tstg, TC TJ dv/dt -55 to +150 -55 to +150 10,000 For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. The heat generated must be less than the thermal conductivity from Junction-to-Ambient: dPD/dTJ < 1/RqJA. (c) Semiconductor Components Industries, LLC, 2006 1 October, 2006 - Rev. 4 Publication Order Number: MBRA340T3/D MBRA340T3 THERMAL CHARACTERISTICS Characteristic Thermal Resistance - Junction-to-Lead (Note 2) Thermal Resistance - Junction-to-Ambient (Note 2) Symbol RJL RJA Value 15 81 Unit C/W ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (Note 3) (IF = 3.0 A) Maximum Instantaneous Reverse Current (VR = 40 V) 2. Mounted on 2 Square PC Board with 1 Square Total Pad Size, PC Board FR4. 3. Pulse Test: Pulse Width 250 s, Duty Cycle 2.0%. IR VF TJ = 25C 0.450 TJ = 25C 0.3 TJ = 100C 0.390 TJ = 100C 15 mA Volts TYPICAL CHARACTERISTICS 10 IF, INSTANTANEOUS FORWARD CURRENT (AMPS) IF, INSTANTANEOUS FORWARD CURRENT (AMPS) 10 1 T = 125C J 1 TJ = 125C TJ = 100C 0.1 0.10 TJ = 100C 0.20 TJ = 25C 0.30 0.40 TJ = -55C 0.50 0.60 0.1 0.10 TJ = 25C 0.20 0.30 0.40 TJ = -55C 0.50 0.60 VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage 100E-3 IR, REVERSE CURRENT (AMPS) 10E-3 1E-3 TJ = 125C TJ = 100C IR, MAXIMUM REVERSE CURRENT (AMPS) 100E-3 TJ = 125C 10E-3 TJ = 100C 1E-3 TJ = 25C TJ = -55C 10E-6 100E-6 10E-6 1E-6 TJ = 25C TJ = -55C 100E-6 100E-9 10E-9 1E-9 0 100E-12 10 20 30 VR, REVERSE VOLTAGE (VOLTS) 40 1E-6 0 10 20 30 VR, REVERSE VOLTAGE (VOLTS) 40 Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current http://onsemi.com 2 MBRA340T3 TYPICAL CHARACTERISTICS IO, AVERAGE FORWARD CURRENT (AMPS) 5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 25 Ipk/IO = 5 Ipk/IO = 10 Ipk/IO = 20 SQUARE WAVE Ipk/IO = p freq = 20 kHz dc PFO, AVERAGE POWER DISSIPATION (WATTS) 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 0.5 1 1.5 Ipk/IO = p Ipk/IO = 5 Ipk/IO = 10 Ipk/IO = 20 2 2.5 3 3.5 4 4.5 5 IO, AVERAGE FORWARD CURRENT (AMPS) SQUARE WAVE dc 45 65 85 105 125 145 TL, LEAD TEMPERATURE (C) Figure 5. Current Derating TJ, DERATED OPERATING TEMPERATURE (C) Figure 6. Forward Power Dissipation 1000 TJ = 25 C 125 115 105 95 85 75 RqJA = 96 C/W 65 55 0 5 35 10 15 20 25 30 VR, DC REVERSE VOLTAGE (VOLTS) 40 RqJA = 43 C/W RqJA = 63 C/W RqJA = 81 C/W RqJA = 22 C/W C, CAPACITANCE (pF) 100 0 5 10 15 20 25 30 VR, REVERSE VOLTAGE (VOLTS) 35 40 Figure 7. Capacitance Figure 8. Typical Operating Temperature Derating http://onsemi.com 3 MBRA340T3 R(t), TRANSIENT THERMAL RESISTANCE (C/W) 100 D = 0.5 0.2 0.1 10 0.05 0.02 0.01 1 SINGLE PULSE 0.1 0.00001 0.0001 0.001 0.01 0.1 t, TIME (S) 1 10 100 1000 Figure 9. Thermal Response, Junction-to-Ambient (min pad) R(t), TRANSIENT THERMAL RESISTANCE (C/W) 100 D = 0.5 0.2 10 0.1 0.05 0.02 0.01 1 0.1 SINGLE PULSE 0.00001 0.0001 0.001 0.01 0.1 t, TIME (S) 1 10 100 1000 Figure 10. Thermal Response, Junction to Ambient (1 inch pad) http://onsemi.com 4 MBRA340T3 PACKAGE DIMENSIONS SMA CASE 403D-02 ISSUE C HE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 403D-01 OBSOLETE, NEW STANDARD IS 403D-02. DIM A A1 b c D E HE L MIN 1.91 0.05 1.27 0.15 2.29 4.06 4.83 0.76 MILLIMETERS NOM MAX 2.16 2.41 0.10 0.15 1.45 1.63 0.28 0.41 2.60 2.92 4.32 4.57 5.21 5.59 1.14 1.52 MIN 0.075 0.002 0.050 0.006 0.090 0.160 0.190 0.030 INCHES NOM 0.085 0.004 0.057 0.011 0.103 0.170 0.205 0.045 MAX 0.095 0.006 0.064 0.016 0.115 0.180 0.220 0.060 b D POLARITY INDICATOR OPTIONAL AS NEEDED (SEE STYLES) A L c A1 SOLDERING FOOTPRINT* 4.0 0.157 2.0 0.0787 2.0 0.0787 SCALE 8:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 5 MBRA340T3/D |
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